Inductive coupling, instead of TSV, for 3D chip interconnect

According to Noriyuki Miura, et al. in “A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface

It communicates through inductive coupling between coils in the stacked chips. TCI is a low-cost wireless version of a through-silicon via (TSV). It can provide competitive performance to TSV while maintaining its cost at close to the same level as wire bonding. Because the interface coils are drawn using existing IC interconnections, we can use a standard CMOS process (without any RF options) for fabrication. Unlike TSV, no additional wafer process steps are required, resulting in low cost. In addition, TCI is covered under the passivation layer of the chip. No electrostatic discharge (ESD) protection devices are needed, resulting in small channel loading. We can achieve an over-Gbit/s data transfer rate with < 10 mW power dissipation. Parallel data bits can be multiplexed into a single coil and burst-transferred.

Advertisements

Tell me (anonymous OK)

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s